MediaTek Dimensity 8300 chip launched with potent gaming, Generative AI

After launching the impressive Dimensity 9300 processor for flagship smartphones, MediaTek has unveiled a slightly lower-end chip: Dimensity 8300. But it is still a very potent chip and is targeted to be used in higher mid-range smartphones. The Dimensity 8300 is a step down compared to the Dimensity 9300 but offers powerful gaming chops and even on-device Generative AI capabilities.

This chip is available in China already, and the first phone to use this will be the Xiaomi Redmi K70E, which launches later this month.

MediaTek Dimensity 8300 has 20% faster CPU and 60% faster GPU than Dimensity 8200

The MediaTek Dimensity 8300 is fabricated on TSMC’s second-generation 4nm process node. It features an octa-core CPU with three clusters: 1x Cortex-A715 (3.35GHz) + 3x Cortex-A715 (3GHz) + 4x Cortex A510 (2.2GHz). All these eight CPU cores are based on ARM’s v9 architecture and collectively offer 20% faster performance than the Dimensity 8200 chip launched last year.

The new chip also features the ARM Mali-G615 MC6 GPU, which is claimed to be 60% faster than last year’s chip. MediaTek also claims that its new chip’s CPU is 30% more power efficient than the Dimensity 8200 with the same workloads, while the GPU is said to be 55% more power efficient at peak speeds. The GPU can drive a Full HD+ resolution screen at 180Hz or a WQHD+ screen at a 120Hz refresh rate.

MediaTek claims that the Dimensity 8300 launches apps from cold (launching for the first time after booting the device) 17% faster and launches apps from standby 47% faster than the Dimensity 8200. The new processor is compatible with quad-channel LPDDR5X DRAM at 8,533Mbps. The chip must be paired with UFS 4.0 storage chips with MCQ (Multi-Circular Queue).

The built-in Imagiq 980 ISP supports up to 320MP camera sensors and up to 4K 60fps video recording with HDR10+. It can also support concurrent image capture from three 32MP camera sensors. The ISP also supports portrait videos (with real-time background blur effect), EIS, HDR, noise reduction, and AI-assisted color correction.

Dimensity 8300 supports on-device Generative AI processing

The MediaTek APU 780 inside the Dimensity 8300 is the first in the segment to support Generative AI with stable diffusion and LLM (Large Language Model). This allows phones to offer Generative AI features like text-to-image, AI-assisted email composing, language correction, and article summaries. This APU is 3.3x faster than the one inside the Dimensity 8200.

Connectivity features of the Dimensity 8300 include sub-6GHz 5G (SA and NSA), Wi-Fi 6E, Bluetooth 5.4 (with LE Audio), NFC, and USB Type-C port. Location and navigation standards on the chip include support for BDS (triple-frequency B1I+ B2a + B1C), Galileo (dual-frequency E1 + E5a), GLONASS (L10F), GPS (triple-frequency L1CA + L5 + L1C), NavIC, and QZSS (dual-frequency L1CA+ L5).

This chip competes with the Snapdragon 7 Gen 3 that was launched a few days ago. Samsung should consider using the Dimensity 8300 in some of its higher mid-range phones as it appears to be a really good, power-efficient, and value-for-money processor.

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